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Key Features 1.AMD Ryzen™ Threadripper™ PRO 3000WX Series Processor, up to 64 Cores 2.Up to 2TB (RDIMM) / 256GB (UDIMM), ECC/Non-ECC, Unbuffered, U-DIMM, R-DIMM, LRDIMM, and 3DS R-DIMM; 3200Mhz in 8 DIMM slots 3.6 PCI-E 4.0 x16 slots M.2 Interface: 4 PCI-E 4.0 x4 (Software RAID 0,1,5,10) M.2 Form Factor: 2280, 22110 M.2 Key: M-key U.2 Int

Key Features 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots Intel® C622 chipset Expansion slots: 1 PCI-E 3.0 x16 (x16 || x8), 1 PCI-E

3rd Gen Intel® Xeon® Scalable processors, Single Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP Intel® C621A Up to 2TB 3DS ECC RDIMM, DDR4-3200MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-3200MHz Up to 2TB Intel® Optane™ Persistent Memory 200 Series, in 8 DIMM slots 2 PCI-E 4.0 x8, 1 PCI-E 4.0 x16, 1 PCI-E 4.0 x8 (in x16 sl

10th Generation Intel® Core™ i9/Core™ i7/Core™i5/Core™i3/Pentium®/Celeron® Processor, Intel® Xeon® W-1200 Processors Single Socket LGA-1200 (Socket H5) supported, CPU TDP support Up to 125W TDP Intel® W480 Up to 128GB Unbuffered ECC/non-ECC UDIMM, DDR4-2933MHz, in 4 DIMM slots 1 PCI-E 3.0 x16, 1 PCI-E 3.0 x4 (in x8 slot), 1 PCI-E 3.0 x4 1

Key Features 3rd Gen Intel® Xeon® Scalable processors, Single Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP Intel® C621A Up to 2TB RDIMM, DDR4-3200MHz; Up to 2TB LRDIMM, DDR4-3200MHz Up to 2TB Intel® Optane™ Persistent Memory 200 Series, in 8 DIMM slots Dual LAN with 10GBase-T with Intel® X550 2 PCI-E 4.0 x16, 2

Intel® Xeon® Processor D-2123IT, CPU TDP support Up to 60W TDP System on Chip Up to 256GB Registered ECC RDIMM, DDR4-2133MHz; Up to 512GB LRDIMM LRDIMM, DDR4-2133MHz, in 4 DIMM slots 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x16 1 Mini-PCI-E, 2 PCI-E 3.0 NVMe x4 Internal Port(s) 1 M.2 M-Key SATA/PCI-E 3.0 x4, 2280 1 M.2 B-Key SATA/PCI-E 3.0 x2, 3042 U.

Key Features 1.Single AMD EPYC™ 7003/7002 Series Processor (7003 Series Processor drop-in support requires BIOS version 2.0 or newer) 2.2TB Registered ECC DDR4 3200MHz SDRAM in 8 DIMMs 3.Expansion slots: 5 PCI-E 4.0 x16 2 PCI-E 4.0 x8 M.2 Interface: 2 PCI-E 4.0 x4 M.2 Form Factor: 2280, 22110 M.2 Key: M-key 4.8 SATA3, 2 M.2, 8 SATA3

Key Features 1.Single AMD EPYC™ 7002 Series Processor 2.2TB Registered ECC DDR4 3200MHz SDRAM in 8 DIMMs 3.Expansion slots: 5 PCI-E 4.0 x16 2 PCI-E 4.0 x8 M.2 Interface: 2 PCI-E 4.0 x4 M.2 Form Factor: 2280, 22110 M.2 Key: M-key 4.2 M.2, 2 SlimSAS x8 (each: 8 SATA3 or 2 NVMe) 5.Dual 10GBase-T LAN via Broadcom BCM57416 6.ASPEED AST250

Key Features 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, Intel® Xeon® W-32xx Processor Single Socket LGA-3647 (Socket P) supported, CPU TDP support 205W TDP Intel® C621 Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz Or 3TB DCPMM, DDR4-2666MHz, in 12 DIMM slots; Xeon-W 32x

AMD A520 (Ryzen AM4) micro ATX motherboard with M.2 support, 1 Gb Ethernet, HDMI/DVI/D-Sub, SATA 6 Gbps, USB 3.2 Gen 2 Type-A AMD AM4 socket: Ready for Ryzen™ 5000 Series/ 4000 G-Series/ 3000 Series Desktop Processors with Radeon™ Graphics Processors Comprehensive cooling: PCH heatsink and Fan Xpert Ultrafast connectivity: M.2 support, 1