Tower

Key Applications - Scientific Virtualization - High Performance Computing - Rendering - AI/Deep Learning Training Key Features Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors Intel® C621A Chipset 16 DIMM Slots; Up to 4TB DRAM; Up to 4TB Intel® Optane™ Persistent Memory (up to 6TB with DRAM) ; 3200/2933/2666 ECC DDR4 L

Key Features ? Cost Effective 1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 3. 4 PCI-E 3.0 x16, 2 PCI-E 3.0 x8 slots 4. 8 Hot-swap 2.5"/3.5" SATA3 (6Gbps) drive bays; RAID 0,

Key Applications - Media and Entertainment Content Creation - Product Design and Engineering Simulation - AI and Deep Learning Key Features 1.AMD Ryzen™ Threadripper™ PRO 3000WX Series Processor, up to 64 Cores 2.8 DIMMs; up to 2TB Registered ECC DDR4 3200-MHz Memory 3.6 PCI-E 4.0 x16 slots M.2 Interface: 4 PCI-E 4.0 x4, RAID 0, 1, 5 &

Specifications Processor / System Bus 1 x Socket P (LGA 3647) Intel® Xeon® W-3200 Processors Core Logic Intel® C621 Chipset Memory Total Slots : 12 (6-channel per CPU, 12 DIMM per CPU) Capacity : Maximum up to 1536GB RDIMM Memory Type : DDR4 2933/2666 Memory Size : 128GB, 64GB, 32GB, 16GB RDIMM/LRDIMM Expansion Slots Total 5 slots Locatio

Key Features • GPU Accelerated Compute • Cloud Computing • Data Center • General purpose, SMB, Web Hosting 1. Dual AMD EPYC™ 7000-Series Processors 2. Up to 2TB Registered ECC DDR4 ?2666MHz SDRAM in 16 DIMMs 3. Expansion slots: ?2 PCI-E x16 slots ?3 PCI-E x8 slots 5. Integrated IPMI 2.0 + KVM with ?dedicated LAN 6. Dual 10G LA

Key Features • GPU Accelerated Compute • Cloud Computing • Data Center • General purpose, SMB, Web Hosting 1. Dual AMD EPYC™ 7000-Series Processors 2. Up to 2TB Registered ECC DDR4 ?2666MHz SDRAM in 16 DIMMs 3. Expansion slots: ?2 PCI-E x16 slots ?3 PCI-E x8 slots 5. Integrated IPMI 2.0 + KVM with ?dedicated LAN 6. Dual 10G LA

Key Features • GPU Accelerated Compute • Cloud Computing • Data Center • General purpose, SMB, Web Hosting 1. Dual AMD EPYC™ 7000-Series Processors 2. Up to 2TB Registered ECC DDR4 ?2666MHz SDRAM in 16 DIMMs 3. Expansion slots: ?2 PCI-E x16 slots ?3 PCI-E x8 slots 5. Integrated IPMI 2.0 + KVM with ?dedicated LAN 6. Dual 10G LA

Key Features ? Cost Effective 1. Dual Socket P (LGA 3647) support 2nd Gen. Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 3. 4 PCI-E 3.0 x16, 2 PCI-E 3.0 x8 slots 4. 8 Hot-swap 3.5" SATA3 drive bays; RAID 0, 1, 5, 10 5.

Key Features • High Performance Workstation • Designed for 2D/3D Content Creation 1. Single Socket R4 (LGA 2066) supports Intel® Xeon® processor W Family 2. Intel® C422 chipset 3. Up to 512GB reg. ECC LRDIMM, up to DDR4-2666MHz; 8 DIMM slots 4. 3 PCI-E 3.0 x16 (8/16/16, 48 lanes), 1 PCI-E 3.0 x4, M.2 Interface: 2 PCI-E 3

Key Features • Entry-Level Workstation • Designed for CAD and 3D Modeling Applications • NVIDIA® Quadro® Professional GPU Support 1. Single socket H4 (LGA 1151) supports Intel® Xeon® E processor, 8th/9th Gen. Intel® Core™ i9/i7/i3 Processors, Intel® Celeron®, Intel® Pentium® 2. Intel® C246 chipset 3. Up to 64GB ECC/non

Key Features 1. Dual Socket P (LGA 3647) support Intel® Xeon® Scalable Processors 2. Up to 2TB 3DS ECC LRDIMM, up to DDR4-2666MHz; 16 DIMM slots 3. 4 PCI-E 3.0 x16, 2 PCI-E 3.0 x8 slots, M.2 Interface: PCI-E 3.0 x4 M.2 Form Factor: 2260, 2280, 22110 M.2 Key: M-Key, 2 PCI-E 3.0 NVMe x4 Internal Port(s) 4. 2x 1GbE L