Tower

Key Applications - Scientific Virtualization - High Performance Computing - Rendering - AI/Deep Learning Training Key Features Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors Intel® C621A Chipset 16 DIMM Slots; Up to 4TB DRAM; Up to 4TB Intel® Optane™ Persistent Memory (up to 6TB with DRAM) ; 3200/2933/2666 ECC DDR4 L

Key Features ? Cost Effective 1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 3. 4 PCI-E 3.0 x16, 2 PCI-E 3.0 x8 slots 4. 8 Hot-swap 2.5"/3.5" SATA3 (6Gbps) drive bays; RAID 0,

Key Applications - Media and Entertainment Content Creation - Product Design and Engineering Simulation - AI and Deep Learning Key Features 1.AMD Ryzen™ Threadripper™ PRO 3000WX Series Processor, up to 64 Cores 2.8 DIMMs; up to 2TB Registered ECC DDR4 3200-MHz Memory 3.6 PCI-E 4.0 x16 slots M.2 Interface: 4 PCI-E 4.0 x4, RAID 0, 1, 5 &

Specifications Processor / System Bus 1 x Socket P (LGA 3647) Intel® Xeon® W-3200 Processors Core Logic Intel® C621 Chipset Memory Total Slots : 12 (6-channel per CPU, 12 DIMM per CPU) Capacity : Maximum up to 1536GB RDIMM Memory Type : DDR4 2933/2666 Memory Size : 128GB, 64GB, 32GB, 16GB RDIMM/LRDIMM Expansion Slots Total 5 slots Locatio

Key Features ? Cost Effective 1. Dual Socket P (LGA 3647) support 2nd Gen. Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 3. 4 PCI-E 3.0 x16, 2 PCI-E 3.0 x8 slots 4. 8 Hot-swap 3.5" SATA3 drive bays; RAID 0, 1, 5, 10 5.

Key Features • High Performance Workstation • Designed for 2D/3D Content Creation 1. Single Socket R4 (LGA 2066) supports Intel® Xeon® processor W Family 2. Intel® C422 chipset 3. Up to 512GB reg. ECC LRDIMM, up to DDR4-2666MHz; 8 DIMM slots 4. 3 PCI-E 3.0 x16 (8/16/16, 48 lanes), 1 PCI-E 3.0 x4, M.2 Interface: 2 PCI-E 3

Key Features • Entry-Level Workstation • Designed for CAD and 3D Modeling Applications • NVIDIA® Quadro® Professional GPU Support 1. Single socket H4 (LGA 1151) supports Intel® Xeon® E processor, 8th/9th Gen. Intel® Core™ i9/i7/i3 Processors, Intel® Celeron®, Intel® Pentium® 2. Intel® C246 chipset 3. Up to 64GB ECC/non

Key Features 1. Dual Socket P (LGA 3647) support Intel® Xeon® Scalable Processors 2. Up to 2TB 3DS ECC LRDIMM, up to DDR4-2666MHz; 16 DIMM slots 3. 4 PCI-E 3.0 x16, 2 PCI-E 3.0 x8 slots, M.2 Interface: PCI-E 3.0 x4 M.2 Form Factor: 2260, 2280, 22110 M.2 Key: M-Key, 2 PCI-E 3.0 NVMe x4 Internal Port(s) 4. 2x 1GbE L

Key Features 1. 300W High-efficiency Power Supply 2. 2x 5.25" external drive bays, 4x 3.5" internal drive bays, 1x 3.5" external drive bay (OEM) 3. Rear 9cm PWM Cooling Fan with tool-less design 4. 1x 8cm Front Intake Fan (optional) 5. 4x I/O expansion slots 6. 2x USB ports (2.0 ready) 7. Power switch & 3 LED indicators 8. Qu

Key Features • Embedded, Compact Mini Tower • 3 Independent Displays • M.2 slot, vPro 1. Single socket H4 (LGA 1151) supports Intel® 7th/6th Gen. Core i7/i5/i3 series, Intel® Celeron® and Intel® Pentium® processors 2. 4 Hot-swap 3.5" drive bays, 2 fixed 2.5" drive bays, support total of 5 hard drives 3. 1 PCI-E 3.0 x

Key Features 1. Single AMD Opteron™ 4000 series (4300 ready) processor (Socket C32) 8/6/4-Core ready; HT3.0 Link support 2. Up to 128GB DDR3 1600MHz ECC Registered DIMM; 4x DIMM sockets 3. 1x PCI-E 2.0 (x8) in x16 slot 4. Two single-Port GbE LAN Controller, 4x USB 2.0 ports, 1x dedicated LAN for system management (IP