Rack

Dimensions (WxHxD, mm) 1U 438 x 43.5 x 815 Motherboard MS93-FS1 CPU 4th Generation Intel® Xeon® Scalable Processors Intel® Xeon® CPU Max Series Intel® Xeon® Platinum Processor, Intel® Xeon® Gold Processor, Intel® Xeon® Silver Processor Dual processor, CPU TDP up to 350W NOTE: If only 1 CPU is installed, some PCIe or memory functions migh

Gigabyte 3-SectionRail kit (Supports CMA)

Key Applications Intel® QuickAssist TechnologyNetworking Application, Firewall, uCPE, Telecom Application Key Features Intel® Xeon® Processor D-2712T, CPU TDP 65W Up to 256GB Registered ECC RDIMM, DDR4-2667MHz; Up to 512GB LRDIMM LRDIMM, DDR4-2667MHz, in 4 DIMM slots 2x Internal 2.5" drive bays(2x PCIe 4.0 NVMe x8 SlimSAS and 1x OCuLink o

Supermicro assembled server based on AS-4124GQ-TNMI, 2x Milan 7763 CPU, 16x 32GB DDR4-3200, 2x SSD 2.5" NVMe PCIe4 960GB, 2x AOC-653106A-HDAT, SMC System Management, AOM-MCM-Q-P, 4x GPU MI250-128G-OAM Item Quantity AS -4124GQ-TNMI 2 PSE-MLN7763-0312 4 MEM-DR432L-HL02-ER32 32 HDS-MUN-MTFDKCC960TFR1BC 4 AOC-653106A-HDAT 4 AOM-MCM-Q-P 2 CBL

Key Features - Embedded Networking Applications - Network Security Appliance - FireWall Applications - Virtualization Server 1. Intel® Atom® processor C3858, Single socket FCBGA 1310 2. System on Chip 3. 2 fixed 2.5" drive bays (top drive bay area share with AOC) 4. Up to 64GB Unbuffered ECC/non-ECC SO-DIMM, up to DD

AS-1114S-WTRT Supermicro AS-1114S-WTRT 1U, 1xSocket SP3, TDP 240W, 8xDDR4, 10x2.5'' Hot-swap, 3xPCI-E 4.0 x16, 2xRJ45 10GBase-T, 1xRJ45 IPMI, 7xUSB 3.0, 1xVGA, 2x500W 1 100-000000049 AMD CPU EPYC 7002 Series 16C/32T Model 7302P (3/3.3GHz Max Boost,128MB, 155W, SP3) Tray 1 M393A8G40AB2-CWE Samsung DRAM 64GB DDR4 RDIMM 3200MHz, 1.2V, (4Gx4)

AS-1114S-WTRT Supermicro AS-1114S-WTRT 1U, 1xSocket SP3, TDP 240W, 8xDDR4, 10x2.5'' Hot-swap, 3xPCI-E 4.0 x16, 2xRJ45 10GBase-T, 1xRJ45 IPMI, 7xUSB 3.0, 1xVGA, 2x500W 1 100-000000049 AMD CPU EPYC 7002 Series 16C/32T Model 7302P (3/3.3GHz Max Boost,128MB, 155W, SP3) Tray 1 M393A8G40AB2-CWE Samsung DRAM 64GB DDR4 RDIMM 3200MHz, 1.2V, (4Gx4)

QUOTATION NO: 8600984349 OPTIMIZED 3U MicroCloud System, X12STE-F, CSE-939HN-R2K20BP SYS-530MT-H12TRF(x9)3U MicroCloud System, X12STE-F, CSE-939HN-R2K20BP(CQ8600984349) EXS16(x9)12% - 4 YRS EXT. WRNTY AFTER FIRST YR (SYSTEM ASSEMB. ORDER) Ext.WarrantyDiscount P4X-UPE2356G-SRKN2(x108)RKL-E E-2356G 1P 6C/12T 3.2G 12M 80W P750 H5 1200 B0 MEM

Key Applications VirtualizationCloud ComputingEnterprise ServerData Center Optimized Key Features Single Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors. Up to 270W TDP. 8 DIMMs; Supports 3DS DDR4-3200: RDIMM/LRDIMM/Intel® DCPMM 2 PCIe 4.0 x16 (FHFL) slots, 1 PCIe 4.0 x16 (LP) slot Intel® Ethernet Controller X550 2x 10GbE RJ

Key Applications VirtualizationCloud ComputingEnterprise ServerData Center OptimizedEntry GPU serverRack Workstation Key Features Single Socket V0 (LGA-1700) supports Intel® Xeon® E-2400 series, Intel® Pentium® processors 4 DIMMs; Up to 128GB of DDR5 ECC UDIMM memory with speeds of up to 4400MHz 1 PCIe 5.0 x16 or 2 PCIe 5.0 x8 (FHFL); 1

https://www.supermicro.com/en/products/system/Mini-ITX/SYS-E300-9D.cfm Key Features ? Network Security Appliance ? Universal Customer Premise Equipment (uCPE) ? Software Defined WAN (SD-WAN) ? NFV Edge Computing Server ? Virtualization Server ? IoT Edge Computing / Gateway 1. Intel® Xeon® processor D-2123IT, 4-Core, 8 Threads, 60W

Key Applications Small BusinessWeb/Hosting ApplicationEmail/Firewall/Print Server Key Features Single Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors. Up to 220W TDP. 8 DIMMs; Supports 3DS DDR4-3200: RDIMM/LRDIMM/Intel® DCPMM 1 PCIe 4.0 x16 (FHHL) slot Intel® Ethernet Controller i350 2x 1GbE RJ45 4x hot-swap 3.5'' Hybrid SAT