Servery, storage

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CPU AnnapurnaLabs Alpine AL324 ARM® Cortex-A57 quad-core 1.7GHz processor CPU Architecture 64-bit ARM Wake on LAN (WOL) Only the 2.5GbE port Floating Point Unit Encryption Engine System Memory 4 GB SODIMM DDR4 (1 x 4 GB) Maximum Memory 16 GB (1 x 16 GB) Memory Slot 1 x SO-DIMM DDR4 Flash Memory 512 MB (Dual boot OS protection) Drive Ba

Essentials Product Collection Intel® Optane™ SSD DC P4800X Series Code Name Products formerly Cold Stream Capacity 1.5 TB Status Launched Launch Date Q3'18 Performance Specifications Sequential Bandwidth - 100% Read (up to) 2500 MB/s Sequential Bandwidth - 100% Write (up to) 2200 MB/s Random Read (100% Span) 550000 IOPS Random Wri

Key Features 8 Hot-plug System Nodes in 4U Each node supports: 1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 12 DIMMs; up to 3TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 3. Expansion slots: 1 PCI-E 3.0 x16 (LP) 1 PCI-E 3.0 x16 (for SIO

DDR4 ... 8GB .......2666MHz ..ECC DIMM CL19.....Kingston * poznámka: označenie MHz je totožné s označením MT/s, ktoré je používané ako nové označenie prenosu dátovej rýchlosti.

CSE-113TQ-R650CB SuperChassis 113TQ-R650CB (Black) Form Factor 23.5" Depth 1U Rackmount Chassis - support for maximum motherboard size of 12" x 13" and 13.68" x 13" (single power only) Processor Support Supports dual, single Intel® / AMD processors Dimensions Height 1.7" (43mm) Width 17.2" (437mm) Depth 23.5" (597mm) Packaging

Key Features - AI / Deep Learning - Video Transcoding 1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 24 DIMMs; up to 6TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 3. 20 PCI-E 3.0 x16 support up to 20 single width GPU; 1 PCI-E 3.0

Key Features - Embedded IoT Computing - SD-WAN and vCPE/uCPE - Hyper-Converged Appliance - Entry-level Network Appliance 1.AMD EPYC™ 3251 SoC Processor, 8 Core/16 Thread, 2.5GHz/50W 2.System on Chip 3.2 Fixed 2.5" drive bay bracket 4.1 PCI-E 3.0 x16 AOC slot (LP), 1 M.2 PCI-E 3.0 x4, 2280, M Key 5.Up to 512GB ECC Registered DDR4-2666Mz SD

16GB DDR4 2666MHz ECC Unbuffered DIMM DDR4 2666MHz ECC Unbuffered DIMM CL19 2RX8 1.2V 288-pin 8Gbit Hynix D * poznámka: označenie MHz je totožné s označením MT/s, ktoré je používané ako nové označenie prenosu dátovej rýchlosti.

Key Features ? SD-WAN and vCPE/uCPE ? Network Security Appliance ? Software Definded WAN ? Embedded IoT Computing ? Hyper-Converged Appliance 1. AMD EPYC™ 3251 SoC Processor, 8 Core/16 Thread 2. Up to 2x 3.5" or 4x 2.5" SATA3 drive bays 3. 1 PCI-E 3.0 x16 4. Up to 512GB LRDIMM or 256GB RDIMM, up to DDR4-2666Hz 5. 4 Gigabit Ethernet ports,

Specifikace hardwaru Specifikace softwaru Procesor Model CPU Intel Xeon D-1567 CPU architektura 64-bit Frekvence CPU 12-core 2.1 (základní) / 2.7 (turbo) GHz Systém hardwarového šifrování (AES-NI) Pamet Systémová pamet 16 GB DDR4 ECC RDIMM Predinstalovaný pametový modul 16 GB (16 GB x 1) Celkový pocet pametových slotu 4 Maximální kapaci