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(32C/64T Model 7573X (2.8/3.6GHz Max Boost, 768MB, 280W, SP3) Tray Technical Specification Specifications CPU: AMD EPYC 7573X CPU Core Name: Milan-X CPU Socket Standard: SP3 CPU Clock Rate: 2.80 GHz Turbo Clock Rate: 3.60 GHz CPU Core Quantity: 32 Threads Quantity: 64 L3 Cache Size: 768 MB Production Technology: 7 nm TDP: 280 W CPU Featu

Features The ThinkSystem PM1653 Read Intensive SAS 24Gb SSDs have the following features: Server-grade SSD suitable for read-intensive workloads Features Samsung’s latest sixth-generation, 128-layer V-NAND storage technology Endurance of 1 drive-writes per day (DWPD) 2.5-inch or 3.5-inch industry standard form factor with hot-swap tray S

Key Features 1. 9.8" depth small form factor 1U, 200W Gold level power supply 2. Optimized for Mini-ITX (6.75"x 6.75") Motherboard 3. Front I/O Ports 4. 1x 3.5" Internal Drive Bay with 1x Half-height, Half-length PCI-E 5. OR 2x 3.5" Internal Drive Bay 6. OR 2x 2.5" Internal Drive Bay with 1x Full-height, Half-length PCI 7. OR 4x 2.5" Int

Specs Chipset Validation N/A Comp. Config 2Gb x 4 Data Rate 2666 MT/s Density 32GB FBGA Code N/A Part Status Production

Chassis Manual Key Features 3U chassis - supports for maximum motherboard sizes: 13.68" x 13" E-ATX and ATX 16 x 3.5" hot-swap SAS/SATA drive bay with SES2, optional 2 x 2.5" hot-swap drive bay 16-port 3U SAS3 12Gbps single-expander backplane, support up to 16x 3.5-inch SAS3/SATA3 HDD/SSD 1U 800/1000W Redundant Titanium Single Output P

Key Features 8x 3.5"/2.5" SAS/SATA Backplane for Hot-Swappable Drives Front HDD Door Lock & Side Panel Intrusion Switch Front I/O Ports: 2x USB 3.0 3x Middle 8cm (5000 rpm) PWM Fans & 2x 8cm (5000 rpm) PWM Fans 4U / Full Tower Chassis Supports max. Motherboard, Sizes E-ATX 13.68" x 13" ATX/Micro ATX 920W Redundant Platinum Level Certified

Key Features 8x 3.5"/2.5" SAS/SATA Backplane for Hot-Swappable Drives Whisper-Quiet (

Essentials Download Specifications Product CollectionIntel® Virtual RAID on CPU (Intel® VROC) Code NameProducts formerly Turtle Bay StatusLaunched Launch Date Q2'17 Target MarketMainstream Supported Operating SystemsWindows* 2016, Windows* 2012 R2, Windows* 10, Windows* 7 SP2 Red Hat Enterprise Linux* 7.3, SUSE Linux Enterprise* 12 SP3 RA

Chassis Manual Key Features 2U chassis supports for maximum motherboard sizes - 13.68" x 13", E-ATX 12" x 13", ATX 12" x 10" motherboards 16 x 2.5" hot-swap SAS/SATA drive bay w/ full SES-II support on SAS motherboards, 1 x 5.25" drive bay 16-port 2U SAS3 12Gbps direct-attached backplane, support up to 16x 2.5-inch SAS3/SATA3 HDD/SSD 1

Key Features 1U Chassis for motherboard support size: (12" x 10") (9.6" x 9.6") 4 x 3.5" hot-swap SAS/SATA drive bay with SES2 1U 4-Port 12Gbps Backplane Support 4x3.5 1U 500W Multi-output power supply w/ PMbus, 80Plus Platinum 1 full height expansion slot(s) 4 x 40x28mm PWM fan(s) Optional 2 x 40x28mm PWM fan(s)

Vysoko spoľahlivý výkon s vylepšeným ukladaním do vyrovnávacej pamäte, čo z neho robí logickú voľbu pre cloudové dátové centrum a rozsiahle aplikácie dátových centier Inovatívna konštrukcia pohonu s použitím hélia. Optimalizované pre vysoký výkon, bezpečnosť a maximálnu úsporu. Exos X sú vyladené pre veľké prenosy údajov a nízku latenc