Supermicro

Key Applications ? Storage HN, VM, Hosting ? Mainstream, Compact File Server Key Features 1. Single Socket H4 (LGA 1151) supports Intel® Xeon® processor E3-1200 v6/v5, Intel® 7th/6th Gen. Core™ i3 series, Intel® Celeron® and Intel® Pentium® 2. Intel® C236 chipset 3. 8 Hot-swap 2.5" SAS/SATA3 Drive Bays 4. Up to 64GB Unbuffered

Key Applications ? Virtualization ? Cloud Computing ? High End Enterprise Server Key Features 1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 24 DIMMs; up to 6TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 3. 2 PCI-E 3.0 x16 (FH, 10.5"L) 4. 2x

Key Features - Corporate Database - Database Processing & Storage - Enterprise Server - HPC, Data Center - iSCSI SAN 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots 3. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 (slot

Key Applications - IoT Edge Computing - Retail, Smart Medical Expert Systems - Networking Appliance - Industrial Automation & Control - Embedded IoT Gateway Key Features 1. Intel® Atom® processor C3558, Single socket FCBGA 1310 2. System on Chip 3. 2x 2.5" 7mm fixed drive bay 4. Up to 256GB registered ECC, up to 64GB u

Key Features 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP Intel® C622 chipset Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots M.2 NGFF connector M.2 Interface: PCI-E 3.0 x4 and

SUPERMICROBlack Front Bezel for SC113,SC113M,SC116,SC119,SC119U

1x AMD CPU EPYC 7002 Series 12C/24T Model 7272 (2.9/3.2GHz Max Boost,64MB, 120W, SP3) 4x DDR4...16GB 3200 MHz DR x4 ECC Reg. . Micron server 1x Kioxia/Toshiba XG6 256GB NVMe M.2 22x80mm

2 x 8-Core Intel® Xeon™ Silver 4208 (8 core) 2.1GHZ/11MB/FC-LGA14 4x DDR4...16GB 2666 MHz SR x4 ECC Reg. . Micron server 1xMicron 5200 MAX 240GB Enterprise SSD SATA 6 Gbit/s, Read/Write: 540 MB/s / 310 MB/s, Read/Write IOPS 88K/53K,3DPWD 1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lak

Key Features 1. Single Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 12 DIMMs; up to 3TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM 3. 4 PCI-E 3.0 x16, 3 PCI-E 3.0 x8 (in x16) slots, M.2 Interface: 4 PCI-E 3.0 x4 M.2 Form Factor: 2242/2260/2280/22110 M.2 Key: M-Key * M.

Key Features ? Cost Effective 1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 3. 4 PCI-E 3.0 x16, 2 PCI-E 3.0 x8 slots 4. 8 Hot-swap 2.5"/3.5" SATA3 (6Gbps) drive bays; RAID 0,

Key Applications - Corporate Database - Database Processing & Storage - Enterprise Server - HPC, Data Center - iSCSI SAN Key Features 1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Opta

Key Features 3rd Gen Intel® Xeon® Scalable processors, Single Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP Intel® C621A Up to 2TB 3DS ECC RDIMM, DDR4-3200MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-3200MHz Up to 2TB Intel® Optane™ Persistent Memory, in 8 DIMM slots 1 PCI-E 4.0 x16, 5 PCI-E 4.0 NVMe x8 Internal Port(s) M.