Supermicro

Key Features - AI / Deep Learning - Video Transcoding 1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 24 DIMMs; up to 6TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 3. 20 PCI-E 3.0 x16 support up to 20 single width GPU; 1 PCI-E 3.0

Key Features - Embedded IoT Computing - SD-WAN and vCPE/uCPE - Hyper-Converged Appliance - Entry-level Network Appliance 1.AMD EPYC™ 3251 SoC Processor, 8 Core/16 Thread, 2.5GHz/50W 2.System on Chip 3.2 Fixed 2.5" drive bay bracket 4.1 PCI-E 3.0 x16 AOC slot (LP), 1 M.2 PCI-E 3.0 x4, 2280, M Key 5.Up to 512GB ECC Registered DDR4-2666Mz SD

Key Features ? SD-WAN and vCPE/uCPE ? Network Security Appliance ? Software Definded WAN ? Embedded IoT Computing ? Hyper-Converged Appliance 1. AMD EPYC™ 3251 SoC Processor, 8 Core/16 Thread 2. Up to 2x 3.5" or 4x 2.5" SATA3 drive bays 3. 1 PCI-E 3.0 x16 4. Up to 512GB LRDIMM or 256GB RDIMM, up to DDR4-2666Hz 5. 4 Gigabit Ethernet ports,

Key Features - Corporate Database - Database Processing & Storage - Enterprise Server - HPC, Data Center - iSCSI SAN 1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 3. 3

Key Features ? Data Center Optimized ? Web Server ? Enterprise Server ? Managed Hosting ? Short Depth 1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 8 DIMMs; up to 2TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM 3. 1 PCI-E 3.0 x8 (FHHL) slot 4. 4 Hot-swap 3.5" SATA3 drive bays 5.

Key Features ? SDN-WAN, vCPE controller box ? NFV Edge Computing Server ? Virtualization Server ? FireWall Applications ? IoT Edge Computing 1. Intel® Xeon® processor D-2146NT, 8-Core, 16 Threads, 80W 2. System on Chip 3. 4x 7mm SSD 4. 1 M.2 slot M key for SSD, 2242/80, 1 M.2 B Key for SSD/ WAN card, 1 Mini-PCI-E with mSATA Su

Key Features ? Appliance Server ? Security/Gateway Server ? Edge Computing 1. Single Socket H4 (LGA 1151) supports Intel® Xeon® processor E-2100 / E-2200 series, 8th/9th Gen. Intel® Core™ i3 Processors, Intel® Celeron®, Intel® Pentium® 2. Intel® C242 chipset 3. Up to 64GB ECC UDIMM, up to DDR4-2666MHz; 2 DIMM slots 4.

Key Features ? Virtualization ? Cloud Computing ? High End Enterprise Server 1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 24 DIMMs; up to 6TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 3. 2 PCI-E 3.0 x16 slots (FH, 10.5" L), 2 PCI-E 3.0

ey Features ? DB Processing & Storage ? Data Center Applications ? Firewall Applications 1. Single AMD EPYC™ 7002 Series Processor 2. 8 DIMMs; up to 2TB 3DS ECC DDR4-3200MHz RDIMM/LRDIMM 3. 2 PCI-E 4.0 x16 (FHFL) slots, 1 PCI-E 4.0* x16 (LP) slot 4. Integrated IPMI 2.0 + KVM with? dedicated LAN • Software Out of Band Lic

Key Applications - DB Processing & Storage - Data Center Applications - Firewall Applications Key Features 1. Single Socket P (LGA 3647) supports 2nd Gen Intel® Xeon® Scalable processor (Cascade Lake/Skylake)‡ 2. 6 DIMMs; up to 1.5TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM 3. 2 PCI-E 3.0 x16 (FHFL) slots, 1 PCI-E 3.0 x8 (LP)

Copper Cable Assembly Perfect for MiniSAS to 4x SATA Cable Applications Supermicro Certified

Key Features Black anodized brushed aluminum fascia front panel with two USB 3.0 ports Removable 3.5" and 2.5" HDD/SSD cages with tool-less trays for up to 10 drives Sound-dampened side panels Tool-less 5.25" device installation with trays to support 3.5" and 2.5" drives Cable management holes with rubber grommets for clean builds Removab