Supermicro

Key Features ? SDN-WAN, vCPE controller box ? NFV Edge Computing Server ? Virtualization Server ? FireWall Applications ? IoT Edge Computing 1. Intel® Xeon® processor D-2146NT, 8-Core, 16 Threads, 80W 2. System on Chip 3. 4x 7mm SSD 4. 1 M.2 slot M key for SSD, 2242/80, 1 M.2 B Key for SSD/ WAN card, 1 Mini-PCI-E with mSATA Su

Key Features ? Appliance Server ? Security/Gateway Server ? Edge Computing 1. Single Socket H4 (LGA 1151) supports Intel® Xeon® processor E-2100 / E-2200 series, 8th/9th Gen. Intel® Core™ i3 Processors, Intel® Celeron®, Intel® Pentium® 2. Intel® C242 chipset 3. Up to 64GB ECC UDIMM, up to DDR4-2666MHz; 2 DIMM slots 4.

Key Features ? Virtualization ? Cloud Computing ? High End Enterprise Server 1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 24 DIMMs; up to 6TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 3. 2 PCI-E 3.0 x16 slots (FH, 10.5" L), 2 PCI-E 3.0

ey Features ? DB Processing & Storage ? Data Center Applications ? Firewall Applications 1. Single AMD EPYC™ 7002 Series Processor 2. 8 DIMMs; up to 2TB 3DS ECC DDR4-3200MHz RDIMM/LRDIMM 3. 2 PCI-E 4.0 x16 (FHFL) slots, 1 PCI-E 4.0* x16 (LP) slot 4. Integrated IPMI 2.0 + KVM with? dedicated LAN • Software Out of Band Lic

Key Applications - DB Processing & Storage - Data Center Applications - Firewall Applications Key Features 1. Single Socket P (LGA 3647) supports 2nd Gen Intel® Xeon® Scalable processor (Cascade Lake/Skylake)‡ 2. 6 DIMMs; up to 1.5TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM 3. 2 PCI-E 3.0 x16 (FHFL) slots, 1 PCI-E 3.0 x8 (LP)

Copper Cable Assembly Perfect for MiniSAS to 4x SATA Cable Applications Supermicro Certified

Key Features Black anodized brushed aluminum fascia front panel with two USB 3.0 ports Removable 3.5" and 2.5" HDD/SSD cages with tool-less trays for up to 10 drives Sound-dampened side panels Tool-less 5.25" device installation with trays to support 3.5" and 2.5" drives Cable management holes with rubber grommets for clean builds Removab

Key Features 1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 3. 4 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 slots, support 5 low-profile AOCs 4. 8x 2.5" SAS3 & 8x 2.5" SATA3 Hot-swap D

Key Features ? Cloud and Virtualization needs ? Connectivity/Storage ??Computer Nodes ? Database Processing & Storage ? High End Enterprise Server ? Hosting & Application delivery 1.Single AMD EPYC™ 7001/7002* Series Processor (*AMD EPYC 7002 series drop-in support requires board revision 2.x) 2.1TB Registered ECC DDR4 2666MHz SDRAM in 8

Key Features ? Backup Storage ? Web or Database Servers ? Compact Network Appliance 1.Single AMD EPYC™ 7001/7002* Series Processor (*AMD EPYC 7002 series drop-in support requires board revision 2.x) 2.2TB Registered ECC DDR4 2666MHz SDRAM in 16 DIMMs 4TB Registered ECC DDR4 3200MHz SDRAM in 16 DIMMs (Board revision 2.x required) 3.Expansi

Key Features ? Multi-Access Edge Computing (MEC) ? Centralized/Cloud Radio Access Network (C-RAN) ? Universal Customer Premise Equipment (uCPE) ? Software Defined WAN (SD-WAN) ? Network Function Virtualization (NFV) ? Artificial Intelligence (AI) 1. Intel® Xeon® D-2123IT Processor, 4-Core, 8 Threads, 2.2 GHz, 60W 2. Up to 512GB

Key Features ? Cloud and Virtualization needs ? Connectivity/Storage ??Computer Nodes ? Database Processing & Storage ? High End Enterprise Server ? Hosting & Application delivery 1.Single AMD EPYC™ 7001/7002* Series Processor (*AMD EPYC 7002 series drop-in support requires board revision 2.x) 2.1TB Registered ECC DDR4 2666MHz SDRAM in 8