Supermicro

Key Features • Mainstream, Entry Appliance • Low Power, Cost effective 1. Single socket H4 (LGA 1151) supports Intel® Xeon® processor E3-1200 v5, Intel® 6th Gen. Core™ i3 series 2. Intel® C232 chipset 3. 1x 3.5" Fixed drive bay or 2x 2.5" drive option 4. Up to 64GB Unbuffered ECC UDIMM DDR4 2133MHz; 4x DIMM slots 5. 1x P

Supermicro/AOC-MGP-i2, DualGigabit Ethernet - MicroLP 2-port GbE card based on Intel i350

Key Features 1. 650W Redundant Power Supply 2. 4x 3.5" Hot-swap SAS / SATA Drive Bays 3. 1x Slim DVD-ROM Drive 4. 4x 4cm Counter-rotating PWM Fans 5. 1x Full-height Universal I/O (UIO Expansion Slot) 6. 1x Full-height, Full-length I/O Expansion Slot 7. 1x Low-profile I/O Expansion Slot 8. Power Switch, Reset, UID Button &

Key Features ? Cost Effective 1. Dual Socket P (LGA 3647) support 2nd Gen. Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 3. 4 PCI-E 3.0 x16, 2 PCI-E 3.0 x8 slots 4. 8 Hot-swap 3.5" SATA3 drive bays; RAID 0, 1, 5, 10 5.

Key Features - Supports up to 4 NVIDIA® GPUs in 1U - Support Active/Passive GPUs - GPU health monitoring with Fan speed control 1. Dual Socket P (LGA 3647) support 2nd Gen. Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 12 DIMMs; up to 3TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™

Key Features - Corporate Database - Database Processing & Storage - Enterprise Server - HPC, Data Center - iSCSI SAN 1. Dual Socket P (LGA 3647) support 2nd Gen. Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 3. 3

Key Features 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support 205W Intel® C622 Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots Expansion slots: 1 PCI-E 3.0 x16, 1 PCI-E 3.0 x16 (x16 ||

Key Features 8th Generation Intel® Core? i3/Pentium®/Celeron® Processor, Intel® Xeon® E-2100 Processor., Single Socket LGA-1151 (Socket H4) supported, CPU TDP support Up to 95W TDP Intel® C246 Up to 128GB Unbuffered ECC UDIMM, DDR4-2666MHz, in 4 DIMM slots 1 PCI-E 3.0 x16 M.2 Interface: 1 SATA/PCI-E 3.0 x4 and 1 PCI-E 3.0 x4 M.2 Form Fa

Key Features ? DB Processing & Storage ? Data Center Applications 1. Single Socket P (LGA 3647) supports 2nd Gen. Intel® Xeon® Scalable processor (Cascade Lake/Skylake)‡ 2. 6 DIMMs; up to 1.5TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM 3. 2 PCI-E 3.0 x16 (FHFL) slots, 1 PCI-E 3.0 x8 (LP) slot 4. 10 Hot-swap 2.5" SATA3 drive b

Key Features - Embedded Security Appliance - Embedded IoT Gateway - Networking Edge Device 1. Intel® Atom® processor C3558, Single socket FCBGA 1310 2. System on Chip 3. 1 fixed 2.5" drive bay (Top drive bay area is shared with AOC. Please remove riser card when installing 2.5" drive on the top.) 4. Up to 256GB reg

Key Features • Industrial Server Solutions • Networking Telephony • Surveillance DCR • GPU Pass-through VM server • Flash Array Server • Head-node Controller 1. Dual Socket P (LGA 3647) support 2nd Gen. Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Sup

Key Features ? General Purpose, SMB, Web Hosting ? Application and data serving ? Archiving, Mail/Finance, Security 1. Single Socket H4 (LGA 1151) supports Intel® Xeon® processor E-2100 / E-2200 series, 8th/9th Gen. Intel® Core™ i3 Processors, Intel® Celeron®, Intel® Pentium® 2. Intel® C246 chipset 3. Up to 128GB ECC UDIMM