Supermicro

Key Features ? DB Processing & Storage ? Data Center Applications 1. Single Socket P (LGA 3647) supports 2nd Gen. Intel® Xeon® Scalable processor (Cascade Lake/Skylake)‡ 2. 6 DIMMs; up to 1.5TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM 3. 2 PCI-E 3.0 x16 (FHFL) slots, 1 PCI-E 3.0 x8 (LP) slot 4. 10 Hot-swap 2.5" SATA3 drive b

Key Features - Embedded Security Appliance - Embedded IoT Gateway - Networking Edge Device 1. Intel® Atom® processor C3558, Single socket FCBGA 1310 2. System on Chip 3. 1 fixed 2.5" drive bay (Top drive bay area is shared with AOC. Please remove riser card when installing 2.5" drive on the top.) 4. Up to 256GB reg

Key Features • Industrial Server Solutions • Networking Telephony • Surveillance DCR • GPU Pass-through VM server • Flash Array Server • Head-node Controller 1. Dual Socket P (LGA 3647) support 2nd Gen. Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Sup

Key Features ? General Purpose, SMB, Web Hosting ? Application and data serving ? Archiving, Mail/Finance, Security 1. Single Socket H4 (LGA 1151) supports Intel® Xeon® processor E-2100 / E-2200 series, 8th/9th Gen. Intel® Core™ i3 Processors, Intel® Celeron®, Intel® Pentium® 2. Intel® C246 chipset 3. Up to 128GB ECC UDIMM

Key Features • Embedded • Security and Surveillance • Appliance Server, Secure Storage • Rack Workstation 1. Single socket H4 (LGA 1151) supports Intel® Xeon® processor E3-1200 v5, Intel® 6th Gen. Core™ i7/i5/i3 series, Intel® Celeron® and Intel® Pentium® 2. Intel® C236 chipset 3. 4x 3.5" Hot-swap SATA3 bays, Intel RST 4. Up

Key Features - Corporate Database - Database Processing & Storage - Enterprise Server - HPC, Data Center - iSCSI SAN 1. Dual Socket P (LGA 3647) support 2nd Gen. Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 3.

Key Features • High Performance Workstation • Designed for 2D/3D Content Creation 1. Single Socket R4 (LGA 2066) supports Intel® Xeon® processor W Family 2. Intel® C422 chipset 3. Up to 512GB reg. ECC LRDIMM, up to DDR4-2666MHz; 8 DIMM slots 4. 3 PCI-E 3.0 x16 (8/16/16, 48 lanes), 1 PCI-E 3.0 x4, M.2 Interface: 2 PCI-E 3

Key Features Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s Intel® C621 Up to 1.5TB 3DS ECC RDIMM, DDR4-2666MHz; Up to 1.5TB 3DS ECC LRDIMM, in 12 DIMM slots 1 PCI-E 3.0 x32 Left Riser Slot, 1 PCI-E 3.0 x16 Right Riser Slot, 1 PCI-E 3.0 x16 for Add-On-Module (AOM) M.2 In

Enclosure with four 2200W Titanium (96% efficiency) power supplies Enclosure SBE-414E Processor Blade Up to 14 2-socket blade servers LED Power LED, Fault LED Ethernet Switch Up to 2x 10G/1G Ethernet switches Switch module not included in the enclosure Management Module One CMM for remote system management with software Management

Key Features - Embedded Security Appliance - Embedded IoT Gateway - Networking Edge Device 1. Intel® Atom® processor C3558, Single socket FCBGA 1310 2. System on Chip 3. 1 fixed 2.5" drive bay (Top drive bay area is shared with AOC. Please remove riser card when installing 2.5" drive on the top.) 4. Up to 256GB reg

Key Features • General Purpose, SMB, Web Hosting • Application and data serving • Archiving, Mail/Finance, Security 1. Single Socket H4 (LGA 1151) supports Intel® Xeon® processor E-2100, 8th Gen. Intel® Core™ i3 Processors, Intel® Celeron®, Intel® Pentium® 2. Intel® C246 chipset 3. Up to 128GB ECC UDIMM, up to DDR4-2666M

Key Features - Supports up to 3 GPUs in 1U - Support Passive GPUs - 2D/3D and CAD Applications - Astrophysics, Chemistry - Cloud and Virtualization 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots 3. 4 PCI-E 3.