Supermicro

Key Features • Embedded • Security and Surveillance • Appliance Server, Secure Storage • Rack Workstation 1. Single socket H4 (LGA 1151) supports Intel® Xeon® processor E3-1200 v5, Intel® 6th Gen. Core™ i7/i5/i3 series, Intel® Celeron® and Intel® Pentium® 2. Intel® C236 chipset 3. 4x 3.5" Hot-swap SATA3 bays, Intel RST 4. Up

Key Features - Corporate Database - Database Processing & Storage - Enterprise Server - HPC, Data Center - iSCSI SAN 1. Dual Socket P (LGA 3647) support 2nd Gen. Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 3.

Key Features • High Performance Workstation • Designed for 2D/3D Content Creation 1. Single Socket R4 (LGA 2066) supports Intel® Xeon® processor W Family 2. Intel® C422 chipset 3. Up to 512GB reg. ECC LRDIMM, up to DDR4-2666MHz; 8 DIMM slots 4. 3 PCI-E 3.0 x16 (8/16/16, 48 lanes), 1 PCI-E 3.0 x4, M.2 Interface: 2 PCI-E 3

Key Features Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s Intel® C621 Up to 1.5TB 3DS ECC RDIMM, DDR4-2666MHz; Up to 1.5TB 3DS ECC LRDIMM, in 12 DIMM slots 1 PCI-E 3.0 x32 Left Riser Slot, 1 PCI-E 3.0 x16 Right Riser Slot, 1 PCI-E 3.0 x16 for Add-On-Module (AOM) M.2 In

Enclosure with four 2200W Titanium (96% efficiency) power supplies Enclosure SBE-414E Processor Blade Up to 14 2-socket blade servers LED Power LED, Fault LED Ethernet Switch Up to 2x 10G/1G Ethernet switches Switch module not included in the enclosure Management Module One CMM for remote system management with software Management

Key Features - Embedded Security Appliance - Embedded IoT Gateway - Networking Edge Device 1. Intel® Atom® processor C3558, Single socket FCBGA 1310 2. System on Chip 3. 1 fixed 2.5" drive bay (Top drive bay area is shared with AOC. Please remove riser card when installing 2.5" drive on the top.) 4. Up to 256GB reg

Key Features • General Purpose, SMB, Web Hosting • Application and data serving • Archiving, Mail/Finance, Security 1. Single Socket H4 (LGA 1151) supports Intel® Xeon® processor E-2100, 8th Gen. Intel® Core™ i3 Processors, Intel® Celeron®, Intel® Pentium® 2. Intel® C246 chipset 3. Up to 128GB ECC UDIMM, up to DDR4-2666M

Key Features - Supports up to 3 GPUs in 1U - Support Passive GPUs - 2D/3D and CAD Applications - Astrophysics, Chemistry - Cloud and Virtualization 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots 3. 4 PCI-E 3.

Key Features • High Density Storage • Object Storage 1U • Scale-out Storage • Ceph / Hadoop • Big Data Analytics 1. Dual Socket P (LGA 3647) support Intel® Xeon® Scalable Processors 2. Up to 1.5TB 3DS ECC LRDIMM, up to DDR4-2666MHz; 12 DIMM slots 3. 2 PCI-E 3.0 x16 slots, 1 PCI-E 3.0 x16 LP slot, 1 PCI-E 3.0 x4 NVMe M.2

Key Features 8th/9th Generation Intel® Core?i3/Pentium®/Celeron® Processor, Intel® Xeon® E-2100 Processor, Intel® Xeon® E-2200 Processor., Single Socket LGA-1151 (Socket H4) supported, CPU TDP support Up to 95W TDP Intel® C242 chipset Up to 128GB DDR4 2666MHz ECC UDIMM; 4 DIMM slots Expansion slots: 1 PCI-E 3.0 x8 (in x16), 2 PCI-E 3.0

Key Features • Entry-Level Workstation • Designed for CAD and 3D Modeling Applications • NVIDIA® Quadro® Professional GPU Support 1. Single socket H4 (LGA 1151) supports Intel® Xeon® E processor, 8th/9th Gen. Intel® Core™ i9/i7/i3 Processors, Intel® Celeron®, Intel® Pentium® 2. Intel® C246 chipset 3. Up to 64GB ECC/non

8th/9th Generation Intel® Core™ i9/Core™ i7/Core™i5/Core™i3/Pentium®/Celeron® Processor, Intel® Xeon® E-2100 Processor, Intel® Xeon® E-2200 Processor Single Socket LGA-1151 (Socket H4) supported, CPU TDP support Up to 95W TDP Intel® C246 Up to 128GB Unbuffered ECC/non-ECC UDIMM, DDR4-2666MHz, in 4 DIMM slots 1 PCI-E 3.0 x4, 1 PCI-E 3.0 x1