Supermicro

Key Applications - Enterprise Server - Database Processing & Storage - Appliance Optimized Storage Key Features Single Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors. Up to 270W TDP. 8 DIMMs; Supports 3DS DDR4-3200: RDIMM/LRDIMM/Intel® DCPMM 2 PCI-E 4.0 x16 (LP) slots, 2 PCI-E 4.0 x8 (LP) slots Intel® Ethernet Controller

Key Applications - Compact 1U Network Security - Video Surveillance - Office Server, DVR/NVR - Digital Signage, POS Key Features Single Socket LGA-1200 (Socket H5) support 10th Gen. Core™ I & Xeon W-1200 processors 4x DIMMs; Up to 128GB Unbuffered ECC/non-ECC UDIMM 1x PCI-E Gen3 x16 HHHL slot 2 Hot-swap 2.5" SATA3 drive bays 4x 40x28mm

3rd Gen Intel® Xeon® Scalable processors, Single Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP Intel® C621A Up to 2TB 3DS ECC RDIMM, DDR4-3200MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-3200MHz Up to 2TB Intel® Optane™ Persistent Memory 200 Series, in 8 DIMM slots 2 PCI-E 4.0 x8, 1 PCI-E 4.0 x16, 1 PCI-E 4.0 x8 (in x16 sl

10th Generation Intel® Core™ i9/Core™ i7/Core™i5/Core™i3/Pentium®/Celeron® Processor, Intel® Xeon® W-1200 Processors Single Socket LGA-1200 (Socket H5) supported, CPU TDP support Up to 125W TDP Intel® W480 Up to 128GB Unbuffered ECC/non-ECC UDIMM, DDR4-2933MHz, in 4 DIMM slots 1 PCI-E 3.0 x16, 1 PCI-E 3.0 x4 (in x8 slot), 1 PCI-E 3.0 x4 1

Key Features 3rd Gen Intel® Xeon® Scalable processors, Single Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP Intel® C621A Up to 2TB RDIMM, DDR4-3200MHz; Up to 2TB LRDIMM, DDR4-3200MHz Up to 2TB Intel® Optane™ Persistent Memory 200 Series, in 8 DIMM slots Dual LAN with 10GBase-T with Intel® X550 2 PCI-E 4.0 x16, 2

Key Features • High Density Storage • Object Storage 1U • Scale-out Storage • Ceph / Hadoop • Big Data Analytics 1. Dual Socket P (LGA 3647) support 2nd Gen. Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 12 DIMMs; up to 3TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 3. 3 PCI-E 3.0 x16

Key Features 2U chassis supports for maximum motherboard sizes - 13.68" x 13.4", E-ATX 12" x 13", ATX 12" x 10" motherboards 16 x 3.5" hot-swap SAS3/SATA drive bay, optional 2 x 2.5" hot-swap SAS/SATA drive bay 12-Port 2U Backplane with Expander support up to 8 x 3.5" SAS3/SATA3 HDD/SDD and 4 x SAS3/SATA3/NVMe Storage Devices,HF,RoHS/REAC

Key Applications - Multi-Access Edge Computing (MEC) - Centralized/Cloud Radio Access Network (C-RAN) - Universal Customer Premise Equipment (uCPE) - Software Defined WAN (SD-WAN) - Network Function Virtualization (NFV) - Artificial Intelligence (AI) Key Features 1. Intel® Xeon® D-2177NT Processor, 14-Core, 28 Threads, 1.9 GHz

Intel® Xeon® Processor D-2123IT, CPU TDP support Up to 60W TDP System on Chip Up to 256GB Registered ECC RDIMM, DDR4-2133MHz; Up to 512GB LRDIMM LRDIMM, DDR4-2133MHz, in 4 DIMM slots 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x16 1 Mini-PCI-E, 2 PCI-E 3.0 NVMe x4 Internal Port(s) 1 M.2 M-Key SATA/PCI-E 3.0 x4, 2280 1 M.2 B-Key SATA/PCI-E 3.0 x2, 3042 U.

Key Features ? uCPE Network Appliance ? Network Security Appliance ? Virtualization 1. Single Socket H4 (LGA 1151) supports Intel® Xeon® processor E-2100 / E-2200 series, 8th Gen. Intel® Core™ i3 Processors, Intel® Celeron®, Intel® Pentium® 2. Intel® C246 chipset 3. Up to 128GB unbuffered ECC UDIMM, DDR4-2666MHz; 4

Key Features 1.Single AMD EPYC™ 7003/7002 Series Processor (7003 Series Processor drop-in support requires BIOS version 2.0 or newer) 2.2TB Registered ECC DDR4 3200MHz SDRAM in 8 DIMMs 3.Expansion slots: 5 PCI-E 4.0 x16 2 PCI-E 4.0 x8 M.2 Interface: 2 PCI-E 4.0 x4 M.2 Form Factor: 2280, 22110 M.2 Key: M-key 4.8 SATA3, 2 M.2, 8 SATA3

CSE-LA25TQC-R609LP Key Features 2U chassis support max. motherboard size - ATX 12" x 10", E-ATX 12" x 13", EE-ATX 13" x 13.68". Support up to ATX 12"x13" MB with rear 2.5" HDD option installed 8x 3.5"(tool-less) or 2.5"(screw) hot-swap SAS3/SATA drive bay Optional 2x 3.5" fixed drive bay, Optional rear 2x 2.5" hot-swap drive bay kit 2U 8-