Supermicro

Intel® Xeon® Processor D-2123IT, CPU TDP support Up to 60W TDP System on Chip Up to 256GB Registered ECC RDIMM, DDR4-2133MHz; Up to 512GB LRDIMM LRDIMM, DDR4-2133MHz, in 4 DIMM slots 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x16 1 Mini-PCI-E, 2 PCI-E 3.0 NVMe x4 Internal Port(s) 1 M.2 M-Key SATA/PCI-E 3.0 x4, 2280 1 M.2 B-Key SATA/PCI-E 3.0 x2, 3042 U.

Key Features ? uCPE Network Appliance ? Network Security Appliance ? Virtualization 1. Single Socket H4 (LGA 1151) supports Intel® Xeon® processor E-2100 / E-2200 series, 8th Gen. Intel® Core™ i3 Processors, Intel® Celeron®, Intel® Pentium® 2. Intel® C246 chipset 3. Up to 128GB unbuffered ECC UDIMM, DDR4-2666MHz; 4

CSE-LA25TQC-R609LP Key Features 2U chassis support max. motherboard size - ATX 12" x 10", E-ATX 12" x 13", EE-ATX 13" x 13.68". Support up to ATX 12"x13" MB with rear 2.5" HDD option installed 8x 3.5"(tool-less) or 2.5"(screw) hot-swap SAS3/SATA drive bay Optional 2x 3.5" fixed drive bay, Optional rear 2x 2.5" hot-swap drive bay kit 2U 8-

Key Features 15" Mini 1U chassis support for maximum motherboard size - 12" x 13" E-ATX 1x Full-height & Half-length expansion slot(s) 2 x 2.5" hot-swap drive bay, optional 4 x 2.5" fixed Internal Drive with bracket Power Switch, UID Button & LED Indicators 4 x 40mm x28mm PWM fan(s) 1U 350W Multi-output Power Supply Platinum Level

Key Features 8 Hot-plug System Nodes in 4U Each node supports: 1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 12 DIMMs; up to 3TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 3. Expansion slots: 1 PCI-E 3.0 x16 (LP) 1 PCI-E 3.0 x16 (for SIO

CSE-113TQ-R650CB SuperChassis 113TQ-R650CB (Black) Form Factor 23.5" Depth 1U Rackmount Chassis - support for maximum motherboard size of 12" x 13" and 13.68" x 13" (single power only) Processor Support Supports dual, single Intel® / AMD processors Dimensions Height 1.7" (43mm) Width 17.2" (437mm) Depth 23.5" (597mm) Packaging

Key Features - AI / Deep Learning - Video Transcoding 1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 24 DIMMs; up to 6TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 3. 20 PCI-E 3.0 x16 support up to 20 single width GPU; 1 PCI-E 3.0

Key Features - Embedded IoT Computing - SD-WAN and vCPE/uCPE - Hyper-Converged Appliance - Entry-level Network Appliance 1.AMD EPYC™ 3251 SoC Processor, 8 Core/16 Thread, 2.5GHz/50W 2.System on Chip 3.2 Fixed 2.5" drive bay bracket 4.1 PCI-E 3.0 x16 AOC slot (LP), 1 M.2 PCI-E 3.0 x4, 2280, M Key 5.Up to 512GB ECC Registered DDR4-2666Mz SD

Key Features ? SD-WAN and vCPE/uCPE ? Network Security Appliance ? Software Definded WAN ? Embedded IoT Computing ? Hyper-Converged Appliance 1. AMD EPYC™ 3251 SoC Processor, 8 Core/16 Thread 2. Up to 2x 3.5" or 4x 2.5" SATA3 drive bays 3. 1 PCI-E 3.0 x16 4. Up to 512GB LRDIMM or 256GB RDIMM, up to DDR4-2666Hz 5. 4 Gigabit Ethernet ports,

Key Features - Corporate Database - Database Processing & Storage - Enterprise Server - HPC, Data Center - iSCSI SAN 1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 3. 3

Key Features ? Data Center Optimized ? Web Server ? Enterprise Server ? Managed Hosting ? Short Depth 1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 8 DIMMs; up to 2TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM 3. 1 PCI-E 3.0 x8 (FHHL) slot 4. 4 Hot-swap 3.5" SATA3 drive bays 5.