Supermicro

Key Features 15" Mini 1U chassis support for maximum motherboard size - 12" x 13" E-ATX 1x Full-height & Half-length expansion slot(s) 2 x 2.5" hot-swap drive bay, optional 4 x 2.5" fixed Internal Drive with bracket Power Switch, UID Button & LED Indicators 4 x 40mm x28mm PWM fan(s) 1U 350W Multi-output Power Supply Platinum Level

Key Features 8 Hot-plug System Nodes in 4U Each node supports: 1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 12 DIMMs; up to 3TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 3. Expansion slots: 1 PCI-E 3.0 x16 (LP) 1 PCI-E 3.0 x16 (for SIO

CSE-113TQ-R650CB SuperChassis 113TQ-R650CB (Black) Form Factor 23.5" Depth 1U Rackmount Chassis - support for maximum motherboard size of 12" x 13" and 13.68" x 13" (single power only) Processor Support Supports dual, single Intel® / AMD processors Dimensions Height 1.7" (43mm) Width 17.2" (437mm) Depth 23.5" (597mm) Packaging

Key Features - AI / Deep Learning - Video Transcoding 1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 24 DIMMs; up to 6TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 3. 20 PCI-E 3.0 x16 support up to 20 single width GPU; 1 PCI-E 3.0

Key Features - Embedded IoT Computing - SD-WAN and vCPE/uCPE - Hyper-Converged Appliance - Entry-level Network Appliance 1.AMD EPYC™ 3251 SoC Processor, 8 Core/16 Thread, 2.5GHz/50W 2.System on Chip 3.2 Fixed 2.5" drive bay bracket 4.1 PCI-E 3.0 x16 AOC slot (LP), 1 M.2 PCI-E 3.0 x4, 2280, M Key 5.Up to 512GB ECC Registered DDR4-2666Mz SD

Key Features ? SD-WAN and vCPE/uCPE ? Network Security Appliance ? Software Definded WAN ? Embedded IoT Computing ? Hyper-Converged Appliance 1. AMD EPYC™ 3251 SoC Processor, 8 Core/16 Thread 2. Up to 2x 3.5" or 4x 2.5" SATA3 drive bays 3. 1 PCI-E 3.0 x16 4. Up to 512GB LRDIMM or 256GB RDIMM, up to DDR4-2666Hz 5. 4 Gigabit Ethernet ports,

Key Features - Corporate Database - Database Processing & Storage - Enterprise Server - HPC, Data Center - iSCSI SAN 1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 3. 3

Key Features ? Data Center Optimized ? Web Server ? Enterprise Server ? Managed Hosting ? Short Depth 1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 8 DIMMs; up to 2TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM 3. 1 PCI-E 3.0 x8 (FHHL) slot 4. 4 Hot-swap 3.5" SATA3 drive bays 5.

Key Features 1.Single AMD EPYC™ 7002 Series Processor 2.2TB Registered ECC DDR4 3200MHz SDRAM in 8 DIMMs 3.Expansion slots: 5 PCI-E 4.0 x16 2 PCI-E 4.0 x8 M.2 Interface: 2 PCI-E 4.0 x4 M.2 Form Factor: 2280, 22110 M.2 Key: M-key 4.2 M.2, 2 SlimSAS x8 (each: 8 SATA3 or 2 NVMe) 5.Dual 10GBase-T LAN via Broadcom BCM57416 6.ASPEED AST250

Key Features 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, Intel® Xeon® W-32xx Processor Single Socket LGA-3647 (Socket P) supported, CPU TDP support 205W TDP Intel® C621 Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz Or 3TB DCPMM, DDR4-2666MHz, in 12 DIMM slots; Xeon-W 32x

Key Features ? SDN-WAN, vCPE controller box ? NFV Edge Computing Server ? Virtualization Server ? FireWall Applications ? IoT Edge Computing 1. Intel® Xeon® processor D-2146NT, 8-Core, 16 Threads, 80W 2. System on Chip 3. 4x 7mm SSD 4. 1 M.2 slot M key for SSD, 2242/80, 1 M.2 B Key for SSD/ WAN card, 1 Mini-PCI-E with mSATA Su

Key Features ? Appliance Server ? Security/Gateway Server ? Edge Computing 1. Single Socket H4 (LGA 1151) supports Intel® Xeon® processor E-2100 / E-2200 series, 8th/9th Gen. Intel® Core™ i3 Processors, Intel® Celeron®, Intel® Pentium® 2. Intel® C242 chipset 3. Up to 64GB ECC UDIMM, up to DDR4-2666MHz; 2 DIMM slots 4.