Supermicro

Key Features 1. Dual Socket P (LGA 3647) support Intel® Xeon® Scalable Processors 2. Up to 2TB 3DS ECC LRDIMM, up to DDR4-2666MHz; 16 DIMM slots 3. 4 PCI-E 3.0 x16, 2 PCI-E 3.0 x8 slots, M.2 Interface: PCI-E 3.0 x4 M.2 Form Factor: 2260, 2280, 22110 M.2 Key: M-Key, 2 PCI-E 3.0 NVMe x4 Internal Port(s) 4. 2x 1GbE L

Key Features • HA, High flexibility, VM, Communication • Application and data serving • Appliance Server 1. Single Socket H4 (LGA 1151) supports Intel® Xeon® processor E-2100, 8th Gen. Intel® Core™ i3 Processors, Intel® Celeron®, Intel® Pentium® 2. Intel® C246 chipset 3. Up to 128GB ECC UDIMM, up to DDR4-2666MHz; 4 DIMM

Key Features • Quad SFP+ Connectors • Super I/O Module (SIOM) Form Factor • Network Virtualization Offloads including VXLAN and NVGRE • Small Packet Performance • Data Plane Developer Kit for efficient packet processing • Low Power Consumption • Intel® Flow Director • Intelligent Offloads • Unified networking providing a single wire sup

Key Features • Virtual Router • FireWall Applications • Virtualization • Low Power, Low Cost Applications 1. Intel® Atom® processor C3850, Single socket FCBGA 1310; TDP 25W TDP 25W 2. 1x 3.5" or 4x 2.5" internal drive bays 3. 1 PCI-E 3.0 x4, 1 mini PCIe with mSATA support (half card only) 4. Up to 64GB Unbuffered ECC/non-ECC

Key Features • Network Security Appliance • Edge Computing Server • Virtualization Server 1. Intel® Atom® processor C3758, Single socket FCBGA 1310; 8-Core, TDP 25W 2. 1x 3.5" or 4x 2.5" internal drive bays 3. 1 PCI-E 3.0 x4, 1 M.2 (M key for SSD, 2242/2280, PCI-E 3.0 x2 or SATA3) 4. Up to 256GB ECC RDIMM DDR4 2400MHz or

Key Features • Connectivity/Storage Compute Nodes • Database Processing & Storage Appliance Platform 1. Single socket P (LGA 3647) supports Intel® Xeon® Scalable Processors 2. Up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 8 DIMM slots 3. 1 PCI-E 3.0 x16, 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8) 4. 2x 10

Key Features - Network Security Appliance - SDN-WAN, vCPE controller box - NFV Edge Computing Server - Virtualization Server - IoT Edge Computing/Gateway 1. Intel® Xeon® processor D-2123IT, 4-Core, 8 Threads, 60W 2. System on Chip 3. 1 Fixed 2.5" drive bay with bracket 4. 1 M.2 slot M key for SSD, 2242/8, 1 M.2 B Key f

Key Features - IoT Edge Computing - DVR / NVR - Machine Automation - Digital Signage - Medical Applications - IoT Gateway 1. Single Socket H4 (LGA 1151) supports: 8th Generation Intel® Core™ i7/i5/i3 / Pentium® / Celeron® processor 2. Intel® Q370 chipset 3. 2 Internal 2.5" drive bays (Top drive bay area can accom

Key Features 1. Dual AMD EPYC™ 7000-Series Processors 2. 2TB Registered ECC DDR4 2666MHz SDRAM in 16 DIMMs 3. Expansion slots: 2 PCI-E 3.0 x16 3 PCI-E 3.0 x8 M.2 Interface: 1 SATA/PCI-E 3.0 x2 M.2 Form Factor: 2280, 22110 M.2 Key: M-key 4. 10 SATA3, 1 M.2, 2 SATA DOM 5. Dual 10GBase-T LAN Ports

Key Features - Corporate Database - Database Processing & Storage - Enterprise Server - HPC, Data Center - iSCSI SAN 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots 3. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 (slot

Key Features - Corporate Database - Database Processing & Storage - Enterprise Server - HPC, Data Center - iSCSI SAN 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots 3. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 (slot

Enclosure MBE-314E-420 (4x PWS) Server Blade Up to 14 hot-swap server blades Node Support Intel® based server blades LED Power LED, Fault LED GbE Switch / Pass-Through Module Up to 2 hot-swap MBM-GEM-001, MBM-GEM-003i, MBM-GEM-003s, MBM-GEM-004, MBM-XEM-001, or MBM-XEM-002 switches Management Module 1 hot-swap Chassis Management Mod