Servery, storage

Drive Configuration Device Location: Internal Form Factor: 3.5" Storage Capacity: 2 TB Supports Data Channel: SATA III-600 Installed Cache Memory Storage Capacity: 128 MB Sector Capacity: 4096 B Performance Rotational Speed: 7200 rpm Internal Data Bit Rate: 175 Mbps External Data Bit Rate: 6 Gbps Reliability Non-Recoverable Errors: 10 per

Enclosure with four 2200W Titanium (96% efficiency) power supplies Enclosure SBE-414E Processor Blade Up to 14 2-socket blade servers LED Power LED, Fault LED Ethernet Switch Up to 2x 10G/1G Ethernet switches Switch module not included in the enclosure Management Module One CMM for remote system management with software Management

Key Features - Embedded Security Appliance - Embedded IoT Gateway - Networking Edge Device 1. Intel® Atom® processor C3558, Single socket FCBGA 1310 2. System on Chip 3. 1 fixed 2.5" drive bay (Top drive bay area is shared with AOC. Please remove riser card when installing 2.5" drive on the top.) 4. Up to 256GB reg

Specs Capacity 1920GB Chipset Validation N/A FBGA Code N/A Interface SATA Op. Temp. Part Status Production Product Line 5210 ION Product Longevity Program No Product Longevity Program Start Date N/A READ 540 MB/s WRITE 260 MB/s

Key Features • General Purpose, SMB, Web Hosting • Application and data serving • Archiving, Mail/Finance, Security 1. Single Socket H4 (LGA 1151) supports Intel® Xeon® processor E-2100, 8th Gen. Intel® Core™ i3 Processors, Intel® Celeron®, Intel® Pentium® 2. Intel® C246 chipset 3. Up to 128GB ECC UDIMM, up to DDR4-2666M

Key Features - Supports up to 3 GPUs in 1U - Support Passive GPUs - 2D/3D and CAD Applications - Astrophysics, Chemistry - Cloud and Virtualization 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots 3. 4 PCI-E 3.

Key Features • High Density Storage • Object Storage 1U • Scale-out Storage • Ceph / Hadoop • Big Data Analytics 1. Dual Socket P (LGA 3647) support Intel® Xeon® Scalable Processors 2. Up to 1.5TB 3DS ECC LRDIMM, up to DDR4-2666MHz; 12 DIMM slots 3. 2 PCI-E 3.0 x16 slots, 1 PCI-E 3.0 x16 LP slot, 1 PCI-E 3.0 x4 NVMe M.2

Key Features • Entry-Level Workstation • Designed for CAD and 3D Modeling Applications • NVIDIA® Quadro® Professional GPU Support 1. Single socket H4 (LGA 1151) supports Intel® Xeon® E processor, 8th/9th Gen. Intel® Core™ i9/i7/i3 Processors, Intel® Celeron®, Intel® Pentium® 2. Intel® C246 chipset 3. Up to 64GB ECC/non

Key Features 1. Dual Socket P (LGA 3647) support Intel® Xeon® Scalable Processors 2. Up to 2TB 3DS ECC LRDIMM, up to DDR4-2666MHz; 16 DIMM slots 3. 4 PCI-E 3.0 x16, 2 PCI-E 3.0 x8 slots, M.2 Interface: PCI-E 3.0 x4 M.2 Form Factor: 2260, 2280, 22110 M.2 Key: M-Key, 2 PCI-E 3.0 NVMe x4 Internal Port(s) 4. 2x 1GbE L

Key Features • HA, High flexibility, VM, Communication • Application and data serving • Appliance Server 1. Single Socket H4 (LGA 1151) supports Intel® Xeon® processor E-2100, 8th Gen. Intel® Core™ i3 Processors, Intel® Celeron®, Intel® Pentium® 2. Intel® C246 chipset 3. Up to 128GB ECC UDIMM, up to DDR4-2666MHz; 4 DIMM

3.5in 26.1MM 8000GB 256MB 7200RPM SATA ULTRA 512E SE 7K8